TRI SPI TR7007Q SII 3D Solder Paste Inspection
Brand Name:TRI
Model:TR7007Q SII
Payment Methods:
The TR7007Q SII is a cutting-edge 3D SPI system designed to enhance your production processes. With its high-speed platform, the 3D SPI delivers up to 50% faster inspection compared to previous models, ensuring optimal efficiency. Experience improved accuracy and stability, allowing for precise solder measurements and minimizing false calls. Equipped with a wide spectrum light system and coaxial lighting*, the TR7007Q SII enhances contrast and detection rates, enabling you to capture intricate details with exceptional clarity. The 3D SPI is an Industry 4.0 Ready Solution supporting the upcoming and innovative protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 standard. (*Optional)
Optical System
|
Imaging Method |
Stop-and-Go Imaging |
|
Camera |
21 Mpix |
|
Imaging Resolution |
9.8 μm |
|
Lighting |
Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting |
|
3D Technology |
4-way Digital Fringe Pattern |
|
Field of View |
50.30 x 40.24 mm |
Inspection Performance
|
Imaging Speed |
Up to 2.6 FOV/sec |
|
Height Resolution |
0.4 μm |
|
Max. Solder Height |
420 μm
* on Calibration Target |
Motion Table & Control
|
X-Axis Control |
Ballscrew + AC Servo with EtherCAT Motion Controller |
|
Y-Axis Control |
Ballscrew + AC Servo with EtherCAT Motion Controller |
|
Z-Axis Control |
Ballscrew + AC Servo with EtherCAT Motion Controller |
|
X-Y Axis Resolution |
1 μm |
|
Z-Axis Resolution |
1 μm |
Board Handling
|
Max PCB Size |
510 x 460 mm |
|
PCB Thickness |
0.6 - 5 mm |
|
Max PCB Weight |
3kg |
|
Top Clearance |
25 mm |
|
Bottom Clearance |
40 mm |
|
Edge Clearance |
3 mm |
|
Conveyor Height |
880 – 920 mm
* SMEMA Compatible |
Inspection Functions
|
Defects |
Insufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging |
|
Measurement |
Height
Area
Volume
Offset |
Dimensions
|
WxDxH |
1000 x 1480 x 1650 mm
Note: not including signal tower, signal tower height 515 mm |
|
Weight |
795 kg |
