TRI AOI TR7700 SIII 3D Automated Optical Inspection
		Brand Name:TRI
		Model:TR7700 SIII
		
        
        
	
	  
		Payment Methods:
		
	            
	          
         
	          
	         
		
	   
	  
      
	   
		 
		
				 TRI's ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
	
		Optical System
	
		
			
				
					| Imaging Method | Dynamic Imaging with true 3D profile measurement | 
				
					| Top Camera | 4 Mpix | 
				
					| Angle Camera | N/A | 
				
					| Imaging Resolution | 10 µm, 15 µm (factory setting) | 
				
					| Lighting | Multi-phase RGB+W LED | 
				
					| 3D Technology | Single/Dual 3D laser sensors | 
				
					| Max. 3D Range | 20 mm | 
			
		
	 
 
	
		Inspection Performance
	
		
			
				
					| Imaging Speed | 4 Mpix@ 10 µm 2D: 60 cm²/sec 4 Mpix@ 15 µm 2D: 120 cm²/sec
 4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*
 4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*
 
 * Depending on board size and laser resolution
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		Motion Table & Control
	
		
			
				
					| X-Axis Control | Ballscrew + AC-servo controller | 
				
					| Y-Axis Control | Ballscrew + AC-servo controller | 
				
					| Z-Axis Control | N/A | 
				
					| X-Y Axis Resolution | 1 µm | 
			
		
	 
 
	
		Board Handling
	
		
			
				
					| Max PCB Size | TR7700 SIII 3D: 510 x 460 mm TR7700L SIII 3D: 660 x 460 mm
 TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane
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					| PCB Thickness | 0.6-5 mm | 
				
					| Max PCB Weight | 3 kg | 
				
					| Top Clearance | 25 mm | 
				
					| Bottom Clearance | 40 mm | 
				
					| Edge Clearance | 3 mm [5 mm optional] | 
				
					| Conveyor | Inline Height: 880 – 920 mm
 
 * SMEMA Compatible
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		Inspection Functions
	
		
			
				
					| Component | Missing Tombstoning
 Billboarding
 Polarity
 Rotation
 Shift
 Wrong Marking (OCV)
 Defective
 Upside Down
 Extra Component
 Foreign Material
 Lifted Component
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					| Solder | Excess Solder Insufficient Solder
 Bridging
 Through-hole Pins
 Lifted Lead
 Golden Finger
 Scratch/Contamination
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		Dimensions
	
		
			
				
					| WxDxH | TR7700 SIII 3D: 1100 x 1670 x 1550 mm TR7700L SIII 3D: 1300 x 1630 x 1655 mm
 TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm
 
 Note: not including signal tower, signal tower height 520 mm
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					| Weight | TR7700 SIII 3D: 1030 kg TR7700L SIII 3D: 1250 kg
 TR7700 SIII 3D DL: 1150 kg
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