Product name: LED die bonding bakelite nozzle
Brand: SPT
Purpose: The main tool for LED automatic die bonding machine to absorb wafers and IC bare chips.
Nozzle type: Special tip
Length: 14mm*4mil
Packing specification: 10 pieces/bag
Model: 2102-14-VES-CT-008-004 TA=20D(4mil)
Used for producing chips with many parts and obstacles, 5mil-8mil, this special tip nozzle can penetrate deep into the bottom of the chip,
can effectively and quickly absorb the chip, and improve production efficiency.